MECHANIC Lead-Free soldering ball 250000PCS/Bottle

Choosing good quality BGA reballing,it is high roundness,high purity,high accuracy,high brightness.Unit reballing diameter tolerance is minuteness and low oxygen.

Good conductive and welding performance , better heat dissipation, improving consumer electronic characteristics ,in which made packaging thinness,  packaging area narrowness, binding points distance shortener.

no need bending pins, to improve product composition rate,It is a kind of high density surface assembly and packaging technology,in which satisfy with short, small, light and thin requirment.

ESD glass bottles packaging,improve storage rate

Application