MECHANIC Lead-Free soldering ball 10000PCS/Bottle

Good conductive and welding performance , better heat dissipation, improving consumer electronic characteristics ,in which made packaging thinness,  packaging area narrowness, binding points distance shortener.

no need bending pins, to improve product composition rate,It is a kind of high density surface assembly and packaging technology,in which satisfy with short, small, light and thin requirment.

ESD glass bottles packaging,improve storage rate

Application

It is mainly used for IC package specific materials, suitable for DIP SOJ SOP TSOP QFP BGA CSP and others craftwork